MR16R1622AF0 SPC, SCHALTUNG, FUNKTION
MR16R1622AF0 Datasheet PDF
| Hersteller | Verpackung | Beschreibung | Temperatur | |
|---|---|---|---|---|
| SAMSUNG[Samsung semiconductor] | (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V |
MR16R1622AF0 PDF | Min.°C | Max°C |
- MR16R1622
Timing Parameters - MR16R16224DF0
Timing Parameters - Samsung semiconductor MR16R16228DF0
Timing Parameters - SAMSUNG[Samsung semiconductor] MR16R1622AF0
(16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V - Samsung semiconductor MR16R1622AF0-CK8
(16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V - Samsung semiconductor MR16R1622AF0-CM8
(16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V - Samsung semiconductor MR16R1622DF0
Key Timing Parameters - Samsung semiconductor MR16R16248EG0
Timing Parameters - Samsung semiconductor MR16R1624AF0
(MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die - Samsung semiconductor MR16R1624AF0-CK8
(16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V - Samsung semiconductor MR16R1624AF0-CM8
(16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V - Samsung semiconductor MR16R1624EG0-CK8
Timing Parameters - Samsung semiconductor MR16R1624EG0-CM8
Timing Parameters - Samsung semiconductor MR16R1624EG0-CT9
Timing Parameters - Samsung semiconductor MR16R1624GEG0
Timing Parameters