BCN31ABL503G7 SPC, SCHALTUNG, FUNKTION
BCN31ABL503G7 Datasheet PDF
| Hersteller | Verpackung | Beschreibung | Temperatur | |
|---|---|---|---|---|
| Bi technologies | R/2R Ladder Network 8 Bit, 2512 Size Thick Film Leadless Chip Packages | Min.°C | Max°C |
- Bi technologies BCN31ABL503G7
R/2R Ladder Network 8 Bit, 2512 Size Thick Film Leadless Chip Packages